Journal of Advances in Physics

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Author: R. Afify Ismail

Date Issued: 2018

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		Issue Date	Title	Author(s)
	1	2018	Influence of Low Ti-Element Additions on The Microstructure, Melting Properties and Creep Behavior of Sn-Ag-Cu Lead Free Solders	Amal Mohamad Yassin ; R. Afify Ismail; B.A. Khalifa