Journal of Advances in Physics

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Journal of Advances in Physics

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Date Issued:  [2000 TO 2998]
Subject:  Creep , snag solder alloys

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Issue DateTitleAuthor(s)
12019Indentation Creep and Microstructure Properties of Sn-Ag Solder AlloysAmal Mohamad Yassin ; B.A. Khalifa; R. Afify Ismail