Microstructure evolution and tensile creep behavior of Sn–0.7Cu lead-free solder reinforced with ZnO nanoparticles
A.M.Yassin; A.F.Abd El‑Rehim; H. Y. Zahran;
Other data
| Title | Microstructure evolution and tensile creep behavior of Sn–0.7Cu lead-free solder reinforced with ZnO nanoparticles | Authors | A.M.Yassin ; A.F.Abd El‑Rehim; H. Y. Zahran | Keywords | Creep, microstructure, lead free solder | Issue Date | 2-Jan-2019 | Volume | 30 | Start page | 2213 | End page | 2223 | DOI | 10-1007/s108-0492-0 |
Recommend this item
Similar Items from Core Recommender Database
Items in Ain Shams Scholar are protected by copyright, with all rights reserved, unless otherwise indicated.