A.M.Yassin

amalyassin@edu.asu.edu.eg
Interests: Material Science,
Internal ID: rp11297
Network Lab View Statistics Email Alert RSS Feed

Profile

Loading... 2 0 20 0 false
 
Full Name
A.M.Yassin
 
Personal Site
 
Email
amalyassin@edu.asu.edu.eg
 
Other emails
 
ORCID
 

Publications

Refined By:
Date Issued:  [2000 TO 2998]

Results 1-9 of 9 (Search time: 0.0 seconds).

Issue DateTitleAuthor(s)
12-Jan-2019Microstructure evolution and tensile creep behavior of Sn–0.7Cu lead-free solder reinforced with ZnO nanoparticlesA.M.Yassin ; A.F.Abd El‑Rehim; H. Y. Zahran
22019Indentation Creep and Microstructure Properties of Sn-Ag Solder AlloysAmal Mohamad Yassin ; B.A. Khalifa; R. Afify Ismail
32019Effects of Zn and Sb additions on microstructure, creep behavior and thermal properties of binary eutectic Sn-0.7%Cu lead-free solderAmal Mohamad Yassin 
42018Influence of Low Ti-Element Additions on The Microstructure, Melting Properties and Creep Behavior of Sn-Ag-Cu Lead Free SoldersAmal Mohamad Yassin ; R. Afify Ismail; B.A. Khalifa
52018Effect of TiO2 Nanoparticles Addition on the Thermal, Microstructural and Room-Temperature Creep Behavior of Sn-Zn Based SolderAmal Mohamad Yassin ; H. Y. Zahran; A. F. Abd El-Rehim
62018Investigation of Microstructure and Creep Properties of Sn-xSb Solder Alloys up to Peritectic CompositionAmal Mohamad Yassin 
72017Structure Analysis, Enhancement of Creep Resistance and Thermal Properties of Eutectic Sn-Ag Lead-Free Solder Alloy by Ti and Cd AdditionsA.M.Yassin ; B.A.Khalifa; R.Afify Ismail
82015The Study of Microstructure and Creep Properties of Cu-Doped Sn-4wt%Ag and Sn-9wt%Zn Lead Free Solders with Annealing TemperatureA.M.Yassin ; E. Gomaa
92009Enhancement of Electrical Conductivity by Al-Doped ZnO Ceramic VaristorsA.M.Yassin ; A. Sedky; Ayman Al-Sawalha